Digitimes reports; "Indium Corporation will feature Heat-Spring, a compressible, recyclable, metal thermal interface material, at the IMAPS 48th Annual International Symposium on Microelectronics, Oct. 26-29 in Orlando, Fla.
The use of high-power LEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials.
Indium Corporation's Heat-Spring is a compressible interface material that provides 86W/mK of thermal conductivity using a pressure range of only 35 to 100+ psi. Heat-Spring is suitable for pick-and-place equipment and offers superior conductivity and ease of use, as compared to thermal grease alternatives. In addition, Heat-Spring will not bake out or pump out, optimizing long-term performance consistency and eliminating the rework process." [INDIUM] via [Frostytech.com]