"While Taiwan-based cooling module makers have been developing 0.6-0.8mm ultra-thin heat-pipes for smartphones, China-based makers have brought continued competitive pressure through upgrading technology and are expected to surpass Taiwan makers in two years, according to sources from cooling module makers.
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Production of notebook cooling modules in 2014 are also mostly being done by China makers.
Japan-based cooling module maker Furukawa has outsourced close to 50% of its shipments to China and the outsourcing is also expected to assist China makers advance their technology, the sources added." [DIGITIMES] via [Frostytech.com]